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| VND5004B-E VND5004BSP30-E Double 4m high side driver with analog current sense for automotive applications Features Parameters Max transient supply voltage Operating voltage range Max on-state resistance Current limitation (typ) Off-state supply current Symbol VCC VCC RON ILIMH IS Value 41 V 4.5 to 28 V 4 m 100 A 2 A(1) MultiPowerSO-30 PQFN 12x12 Power lead-less 1. Typical value with all loads connected. - Reverse battery protection with self switch on of the Power MOSFET (see Figure 22) - Electrostatic discharge protection application All types of resistive, inductive and capacitive loads Suitable for power management applications General - Inrush current active management by power limitation - Very low standby current - 3.0 V CMOS compatible input - Optimized electromagnetic emission - Very low electromagnetic susceptibility - In compliance with the 2002/95/EC European directive Diagnostic functions - Proportional load current sense - Current sense disable - Thermal shutdown indication Protection - Undervoltage shutdown - Overvoltage clamp - Load current limitation - Thermal shutdown - Self limiting of fast thermal transients - Protection against loss of ground and loss of VCC Devices summary Package PQFN-12x12 power lead-less MultiPowerSO-30 Description The VND5004BTR-E and VND5004BSP30-E are devices made using STMicroelectronics VIPower technology. They are intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp and load dump protection circuit protect the devices against transients on the Vcc pin (see ISO7637 transient compatibility table). These devices integrate an analog current sense which delivers a current proportional to the load current (according to a known ratio) when CS_DIS is driven low or left open. When CS_DIS is driven high, the CURRENT SENSE pin is high impedance. Output current limitation protects the devices in overload condition. In case of long duration overload, the devices limit the dissipated power to a safe level up to thermal shutdown intervention. Thermal shutdown with automatic restart allows the device to recover normal operation as soon as a fault condition disappears. Order codes Table 1. Tube VND5004BSP30-E Tape and reel VND5004BTR-E VND5004BSP30TR-E Tray VND5004B-E - May 2009 Doc ID 15702 Rev 1 1/33 www.st.com 1 Contents VND5004B-E, VND5004BSP30-E Contents 1 2 Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 2.2 2.3 2.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 3.2 3.3 Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 19 4 Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 4.2 MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 PQFN - 12x12 power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . . 22 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.1 5.2 5.3 5.4 5.5 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . 27 MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 PQFN - 12x12 power lead-less packing information . . . . . . . . . . . . . . . . 30 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical transient requirements (part 1/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical transient requirements (part 2/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical transient requirements (part 3/3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Thermal parameters for PQFN - 12x12 power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 24 MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 PQFN - 12x12 power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Doc ID 15702 Rev 1 3/33 List of figures VND5004B-E, VND5004BSP30-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 ILIMH vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Rthj-amb vs PCB copper area in open box free air condition (one channel on) . . . . . . . . . 20 MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel on) . . . 21 Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . . 21 12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Rthj-amb vs PCB copper area in open box free air condition (one channel on) . . . . . . . . . 23 PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse (one channel on) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Thermal fitting model of a double channel HSD in PQFN - 12x12 power lead-less . . . . . 24 MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 PQFN - 12x12 power lead-less outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 MultiPowerSO-30 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 PQFN - 12x12 power lead-less tray shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . 30 PQFN - 12x12 power lead-less tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . 31 4/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Block diagram and pin configurations 1 Block diagram and pin configurations Figure 1. Block diagram VCC VCC clamp GND Reverse battery protection Under voltage DRIVER PwCLAMP OUTPUT1 ILIM Overtemp. PwrLIM IOUT1 CS_DIS K CURRENT SENSE1 INPUT1 LOGIC DRIVER PwCLAMP OUTPUT2 ILIM Overtemp. PwrLIM IOUT2 CS_DIS K CURRENT SENSE2 INPUT2 CS_DIS Table 2. Pin functions Name VCC Battery connection Power output Ground connection Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch state Function OUTPUT1,2 GND INPUT1,2 CURRENT SENSE1,2 Analog current sense pin, delivers a current proportional to the load current CS_DIS Active high CMOS compatible pin, to disable the current sense pins Doc ID 15702 Rev 1 5/33 Block diagram and pin configurations Figure 2. Configuration diagram (not in scale) 12 11 10 9 8 7 6 5 4 3 2 1 VND5004B-E, VND5004BSP30-E 15 PQFN -12x12 Power lead - less (bottom view) 13 14 16 1 NC 2 NC 3 NC 4 GND 5 CS_DIS 6 CURRENT SENSE 2 7 CURRENT SENSE 1 8 INPUT 2 9 INPUT 1 10 NC 11 NC 12 NC 13 FOR TEST ONLY 14 VCC 15 OUTPUT 1 16 OUTPUT 2 VCC NC FOR TEST ONLY NC NC GND CS_DIS CURRENT SENSE 2 CURRENT SENSE 1 INPUT 2 INPUT 1 NC FOR TEST ONLY NC VCC 1 30 VCC Heat Slug1 15 16 VCC OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 2 MultiPowerSO-30 NC (top view) OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 1 VCC Table 3. Suggested connections for unused and not connected pins N.C. X X Output X Not allowed Input X CS_DIS X For test only X Not allowed Connection/pin Current sense Floating To ground Not allowed Through 1 k resistor Through Through 10 k resistor 10 k resistor 6/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Electrical specifications 2 Electrical specifications Figure 3. Current and voltage conventions IS VCC VCC IOUT1,2 OUTPUT1,2 VOUT1,2 INPUT1,2 CURRENT SENSE1,2 VIN1,2 GND IGND ISENSE1,2 VSENSE1,2 ICSD IIN1,2 CS_DIS VCSD 2.1 Absolute maximum ratings Stress values that exceed those listed in the "Absolute maximum ratings" table can cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions greater than those, indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality documents. Table 4. Symbol VCC VCCPK -VCC IOUT - IOUT IIN ICSD VCSENSE DC supply voltage Transient supply voltage (T<400 ms, Rload>0.5 ) Reverse DC supply voltage DC output current Reverse DC output current DC input current DC current sense disable input current Current sense maximum voltage (Vcc>0 V) Maximum switching energy (single pulse) (L=0.3 mH; RL=0 ; Vbat=13.5 V; Tjstart=150 C; IOUT = IlimL(typ.)) Electrostatic discharge (Human Body Model: R=1.5 k; C=100 pF) Absolute maximum ratings Parameter Value 28 41 16 Internally limited 70 -1 to 10 -1 to 10 Vcc-41 +VCC 342 Unit V V V A A mA mA V V mJ EMAX VESD 2000 V Doc ID 15702 Rev 1 7/33 Electrical specifications Table 4. Symbol VESD Tj TSTG VND5004B-E, VND5004BSP30-E Absolute maximum ratings (continued) Parameter Charge device model (CDM-AEC-Q100-011) Junction operating temperature Storage temperature Value 750 -40 to 150 -55 to 150 Unit V C C 2.2 Thermal data Table 5. Symbol Thermal data Value Parameter MultiPowerSO-30 12x12 PLLP 0.35 39(2) C/W C/W Thermal resistance junction-case (MAX) (with one channel ON) Thermal resistance junction-ambient (MAX) Unit Rthj-case Rthj-amb 0.35 58(1) 1. PCB FR4 area 58 mmx58 mm, PCB thickness 2 mm, Cu thickness 35 m, minimum pad layout. 2. PCB FR4 area 78 mmx78 mm, PCB thickness 2 mm, Cu thickness 35 m, minimum pad layout. 8/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Electrical specifications 2.3 Electrical characteristics Values specified in this section are for 8 V Symbol Electrical characteristics Parameter Test conditions Min. Typ. Max. Unit Power section VCC VUSD VUSDhyst Operating supply voltage Undervoltage shutdown Undervoltage shutdown hysteresis On-state resistance(1) Rdson in reverse battery condition VCC clamp voltage Supply current IOUT=15 A; Tj=25 C IOUT=15 A; Tj=150 C IOUT=15 A; VCC=5 V; Tj=25 C VCC=-13 V; IOUT=-15 A; Tj=25 C ICC=20 mA; IOUT1,2=0 A Off-state; VCC=13 V; Tj=25 C; VIN=VOUT=VSENSE=VCSD=0 V On-state; VCC=13 V; VIN=5 V; IOUT=0 A VIN=VOUT=0 V; VCC=13 V; Tj=25 C VIN=VOUT=0 V; VCC=13 V; Tj=125 C 0 0 41 46 2(2) 3.5 0.01 4.5 13 3.5 0.5 4 8 6 4 52 5(2) 6 3 5 28 4.5 V V V m m m m V A mA A RON RON REV Vclamp IS IL(off) Off-state output current(1) Switching (VCC = 13V; Tj = 25C) td(on) td(off) Turn-on delay time Turn-on delay time RL= 0.87 (see Figure 5) RL= 0.87 (see Figure 5) 25 35 See Figure 16 See Figure 18 5.4 2.3 s s V/s V/s mJ mJ (dVOUT/dt)on Turn-on voltage slope RL= 0.87 (dVOUT/dt)off Turn-off voltage slope RL= 0.87 WON WOFF Logic inputs VIL1,2 IIL1,2 VIH1,2 Input low level voltage Low level input current Input high level voltage VIN=0.9 V 1 2.1 Switching energy losses during twon Switching energy losses during twoff RL= 0.87 (see Figure 5) RL= 0.87 (see Figure 5) 0.9 V A V Doc ID 15702 Rev 1 9/33 Electrical specifications Table 6. Symbol IIH1,2 VI(hyst)1,2 VICL1,2 VCSDL ICSDL VCSDH ICSDH VCSD(hyst) VCSCL VND5004B-E, VND5004BSP30-E Electrical characteristics (continued) Parameter High level input current Input hysteresis voltage Input clamp voltage CS_DIS low level voltage Low level CS_DIS current CS_DIS high level voltage High level CS_DIS current CS_DIS hysteresis voltage CS_DIS clamp voltage ICSD=1 mA ICSD=-1 mA VCSD=2.1 V 0.25 5.5 -0.7 7 VCSD=0.9 V 1 2.1 10 IIN=1 mA IIN=-1 mA VIN=2.1 V 0.25 5.5 -0.7 0.9 7 Test conditions Min. Typ. Max. 10 Unit A V V V V A V A V V V Protections and diagnostics (3) IlimH Short circuit current Short circuit current during thermal cycling Shutdown temperature Reset temperature Thermal reset of STATUS Thermal hysteresis (TTSD-TR) Turn-off output voltage clamp IOUT=2 A; VIN=0; L=6 mH VCC-28 VCC=13 V 5 V 40 TTSD TR TRS THYST VDEMAG 150 TRS+1 135 175 TRS+5 200 C C C 7 VCC-32 VCC-35 C V Current sense (8 V IOUT/ISENSE 10/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Table 6. Symbol Electrical specifications Electrical characteristics (continued) Parameter Test conditions IOUT=30A; VSENSE=4V; VCSD=0V; Tj= -40C...150C Tj= 25C...150C Min. Typ. Max. Unit K2 IOUT/ISENSE 12400 14000 0 0 5 16500 16500 19000 19000 5 400 A A V ISENSE0 IOUT=0 A; VSENSE=0 V; Analog sense current VCSD=5 V; VIN=0 V; Tj=-40 C to 150 C VCS D=0 V; VIN=5 V; Tj=-40 C to 150C Max analog sense output voltage Analog sense output voltage in over temperature condition Analog sense output current in over temperature condition Delay response time from falling edge of CS_DIS pin Delay response time from rising edge of CS_DIS pin Delay response time from rising edge of INPUT pin Delay response time from falling edge of INPUT pin IOUT=45 A; VCSD=0 V; RSENSE=3.9 k VSENSE VSENSEH VCC=13 V; RSENSE=3.9 k 9 V ISENSEH Vcc=13 V; VSENSE=5 V 8 mA tDSENSE1H VSENSE<4 V, 5 A 100 s tDSENSE1L 5 20 s tDSENSE2H 270 600 s tDSENSE2L 100 250 s 1. For each channel. 2. PowerMOS leakage included. 3. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. Figure 4. Current sense delay characteristics INPUT CS_DIS LOAD CURRENT SENSE CURRENT tDSENSE2H tDSENSE1L tDSENSE1H tDSENSE2L Doc ID 15702 Rev 1 11/33 Electrical specifications Figure 5. Switching characteristics VOUT tWon 80% dVOUT/dt(on) tr 10% tf VND5004B-E, VND5004BSP30-E tWoff 90% dVOUT/dt(off) t INPUT td(on) td(off) t Table 7. Truth table Conditions Inputn L H L H L H L H H L H L Outputn L H L L L L L L L H H L SENSEn (VCSD=0 V)(1) (see Figure 4) 0 Nominal 0 VSENSEH 0 0 0 0 if Tj < TTSD VSENSEH if Tj > TTSD 0 < Nominal 0 Normal operation Over temperature Undervoltage Short circuit to GND (RSC 10 m) Short circuit to VCC Negative output voltage clamp 1. If VCSD is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and the external circuit. 12/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Table 8. Electrical transient requirements (part 1/3) Test levels(1) III -75 V +37 V -100 V +75 V -6 V +65 V IV -100 V +50 V -150 V +100 V -7 V +87 V Number of pulses or test times 5000 pulses 5000 pulses 1h 1h 1 pulse 1 pulse Electrical specifications ISO 7637-2: 2004(E) test pulse 1 2a 3a 3b 4 5b (2) Burst cycle/pulse repetition time 0.5 s 0.2 s 90 ms 90 ms 5s 5s 100 ms 100 ms Delays and impedance 2 ms, 10 50 s, 2 0.1 s, 50 0.1 s, 50 100 ms, 0.01 400 ms, 2 Table 9. Electrical transient requirements (part 2/3) Test level results(1) III C C C C C C IV C C C C C C ISO 7637-2: 2004(E) test pulse 1 2a 3a 3b 4 5b(2) (3) 1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b 2. Valid in case of external load dump clamp: 40V maximum referred to ground. 3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 4.: Absolute maximum ratings. Table 10. Class C E Electrical transient requirements (part 3/3) Contents All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device are not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 15702 Rev 1 13/33 Electrical specifications Figure 6. Waveforms VND5004B-E, VND5004BSP30-E NORMAL OPERATION INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn VCC INPUTn CS_DIS LOAD CURRENTn SENSE CURRENTn UNDERVOLTAGE VUSDhyst VUSD OUTPUT SHORT TO VCC INPUTn CS_DIS LOAD VOLTAGEn LOAD CURRENTn SENSE CURRENTn current power limitation limitation thermal cycling SHORTED LOAD NORMAL LOAD 14/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Electrical specifications 2.4 Electrical characteristics curves Figure 7. Iloff (uA) 6 5.4 4.8 4.2 3.6 3 2.4 1.8 1.2 0.6 0 -50 -25 0 25 50 75 100 125 150 175 Off-state output current Figure 8. Iih (uA) 5 4.5 High level input current Off State Vcc=13V Vin=Vout=0V Vin=2.1V 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 9. Vicl (V) 7 6.75 Input clamp voltage Figure 10. Input low level Vil (V) 2 1.8 Iin=1mA 6.5 1.6 1.4 6.25 6 5.75 5.5 1.2 1 0.8 0.6 0.4 5.25 5 -50 -25 0 25 50 75 100 125 150 175 0.2 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 11. Vih (V) 4 3.5 3 Input high level Figure 12. Input hysteresis voltage Vihyst (V) 1 0.9 0.8 0.7 2.5 2 1.5 1 0.6 0.5 0.4 0.3 0.2 0.5 0 -50 -25 0 25 50 75 100 125 150 175 0.1 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Doc ID 15702 Rev 1 15/33 Electrical specifications VND5004B-E, VND5004BSP30-E Figure 13. On-state resistance vs Tcase Ron (mOhm) 6 Figure 14. On-state resistance vs VCC Ron (mOhm) 6 5.4 5.4 4.8 Iout=15A Vcc=13V 4.8 Tc=150C Tc=125C 4.2 4.2 3.6 3.6 3 3 Tc=25C Tc=-40C 2.4 2.4 1.8 -50 -25 0 25 50 75 100 125 150 175 1.8 0 4 8 12 16 20 24 28 Tc (C) Vcc Figure 15. Undervoltage shutdown Vusd (V) 16 14 12 Figure 16. Turn-on voltage slope (dVout/dt)on (V/ms) 500 450 400 350 Vcc=13V RI=0.87Ohm 10 8 6 4 300 250 200 150 100 2 0 -50 -25 0 25 50 75 100 125 150 175 50 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 17. ILIMH vs Tcase Ilimh (A) 150 140 130 120 110 100 90 80 70 60 50 -50 -25 0 25 50 75 100 125 150 175 Figure 18. Turn-off voltage slope (dVout/dt)off (V/ms) 500 450 Vcc=13V 400 350 300 250 200 150 100 50 0 -50 Vcc=13V RI=0.87Ohm -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) 16/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Electrical specifications Figure 19. CS_DIS high level voltage Vcsdh (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Figure 20. CS_DIS clamp voltage Vcsdcl (V) 8 7.5 7 6.5 6 5.5 5 4.5 4 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Tc (C) Figure 21. CS_DIS low level voltage Vcsdl (V) 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Doc ID 15702 Rev 1 17/33 Application information VND5004B-E, VND5004BSP30-E 3 Application information Figure 22. Application schematic +5V VCC 20V Rprot CS_DIS Dld MCU Rprot INPUT Rprot CURRENT SENSE 45V OUTPUT RSENSE Cext GND 3.1 Microcontroller I/Os protection When negative transients are present on the VCC line, the control pins will be pulled negative to approximately -1.5 V. ST suggests the insertion of resistors (Rprot) in the lines to prevent the C I/Os pins from latching up. The values of these resistors provide a compromise between the leakage current of the C, the current required by the HSD I/Os (input levels compatibility) and the latch-up limit of the C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH) / IIHmax Calculation example: For VCCpeak= - 1.5 V and Ilatchup 20 mA; VOHC 4.5 V 75 Rprot 240 k. Recommended values: Rprot =10 k, CEXT=10 nF 3.2 Load dump protection Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCCPK max rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 18/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Application information 3.3 Maximum demagnetization energy (VCC = 13.5 V) Figure 23. Maximum turn-off current versus inductance 100 A B C 10 I (A) 1 1 L (mH) 10 100 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL = 0 . In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. Doc ID 15702 Rev 1 19/33 Package and PC board thermal data VND5004B-E, VND5004BSP30-E 4 4.1 Package and PC board thermal data MultiPowerSO-30 thermal data Figure 24. MultiPowerSO-30 PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 58 mm x 58 mm, PCB thickness=2 mm, Cu thickness=70 m (front and back side), Copper areas: from minimum pad lay-out to 4 cm2). Figure 25. Rthj-amb vs PCB copper area in open box free air condition (one channel on) RTHj_amb(C/W) 60 55 50 45 40 35 0 1 2 3 4 5 PCB Cu heatsink area (cm^2) 20/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and PC board thermal data Figure 26. MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel on) ZTH (C/W) 1000 100 Footprint 4 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Figure 27. Thermal fitting model of a double channel HSD in MultiPowerSO-30(a) a. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. Doc ID 15702 Rev 1 21/33 Package and PC board thermal data Equation 1: pulse calculation formula Z TH =R TH +Z THtp (1 - ) where = tP/T Table 11. VND5004B-E, VND5004BSP30-E Thermal parameters for MultiPowerSO-30 Area/island (cm2) R1 (C/W) R2 (C/W) R3 (C/W) R4 (C/W) R5 (C/W) R6 (C/W) R7 (C/W) R8 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) C7 (W.s/C) C8 (W.s/C) Footprint 0.05 0.3 0.5 1.3 14 44.7 0.05 0.3 0.005 0.008 0.01 0.3 0.6 5 0.005 0.008 11 23.7 4 4.2 PQFN - 12x12 power lead-less thermal data Figure 28. 12x12 Power lead-less package PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 78 mm x 78 mm, PCB thickness=2mm, Cu thickness=70 m (front and back side), Copper areas: from minimum pad lay-out to 16 cm2). 22/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and PC board thermal data Figure 29. Rthj-amb vs PCB copper area in open box free air condition (one channel on) 50 45 40 35 30 25 20 0 5 10 PCB Cu heat sink area ( cm^ 2) 15 20 Figure 30. PQFN - 12x12 power lead-less package thermal impedance junction ambient single pulse (one channel on) 100 Footprint 4 cm2 8 cm2 10 16 cm2 C/W 1 0,1 0,001 0,01 0,1 time (s) 1 10 100 1000 Doc ID 15702 Rev 1 23/33 Package and PC board thermal data VND5004B-E, VND5004BSP30-E Figure 31. Thermal fitting model of a double channel HSD in PQFN - 12x12 power leadless(b) Equation 2: pulse calculation formula Z TH =R TH +Z THtp (1 - ) where = tP/T Table 12. Thermal parameters for PQFN - 12x12 power lead-less Footprint 0.3 0.15 4.2 9.6 15.1 16.7 0.3 0.15 0.021 0.015 0.2 1.9 2.45 11.85 0.021 0.015 2.2 7.3 22 2.32 13.7 25 2.45 20 30 9.4 10.5 12 9.2 8.5 9 9 5.5 6 4 8 16 Area/island (cm2) R1 (C/W) R2 (C/W) R3 (C/W) R4 (C/W) R5 (C/W) R6 (C/W) R7 (C/W) R8 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C) C7 (W.s/C) C8 (W.s/C) b. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. 24/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and packing information 5 5.1 Package and packing information ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 5.2 MultiPowerSO-30 mechanical data Figure 32. MultiPowerSO-30 outline Doc ID 15702 Rev 1 25/33 Package and packing information Table 13. MultiPowerSO-30 mechanical data VND5004B-E, VND5004BSP30-E Millimeters Symbol Min. A A2 A3 B C D E E1 "e" F6 F7 F8 L N S 0 Deg 0.8 1.85 0 0.42 0.23 17.1 18.85 15.9 1 14.3 5.45 0.73 1.15 10 Deg 7 Deg 16 17.2 Typ. Max. 2.35 2.25 0.1 0.58 0.32 17.3 19.15 16.1 26/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and packing information 5.3 PQFN - 12x12 power lead-less mechanical data Figure 33. PQFN - 12x12 power lead-less outline Doc ID 15702 Rev 1 27/33 Package and packing information Table 14. VND5004B-E, VND5004BSP30-E PQFN - 12x12 power lead-less mechanical data Millimeters Min. 2 0 0.35 0.50 11.90 4.65 10.45 4.80 4.80 11.90 2.15 5.15 1.70 0.90 3.45 1.10 0.50 0.60 0.75 1.65 0.76 11.10 11.10 0.1 0.05 0.05 0.1 0.95 1.90 0.78 11.30 11.30 12.10 4.95 10.65 5 5 12.10 2.45 5.45 2 Typ. Max. 2.2 0.05 0.47 Symbol A A1 b C D Dh1 Dh2 Dh3 Dh4 E Eh1 Eh2 Eh3 e1 e2 e3 f f1 L L1 L2 M N v w y y1 28/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and packing information 5.4 MultiPowerSO-30 packing information The devices can be packed in tube or tape and reel shipments (see the Devices summary on page 1 for packaging quantities). Figure 34. MultiPowerSO-30 tube shipment (no suffix) Tube dimension Dimension mm A C Base Q.ty Bulk Q.ty Tube length ( 0.5) B A B C ( 0.13) 29 435 532 3.82 23.6 0.8 Figure 35. MultiPowerSO-30 tape and reel shipment (suffix "TR") Reel dimension Dimension Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) D (min) G (+ 2 / -0) N (min) T (max) mm 1000 1000 330 1.5 13 20.2 32 100 38.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Description Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth End Dimension W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.1) K (max) mm 32 4 24 1.5 2 14.2 2.2 Start Top cover tape No components 500 mm min 500 mm min Empty components pockets User direction of feed Components No components Doc ID 15702 Rev 1 29/33 Package and packing information VND5004B-E, VND5004BSP30-E 5.5 PQFN - 12x12 power lead-less packing information The devices can be packed in tray or tape and reel shipments (see the Devices summary on page 1 for packaging quantities). Figure 36. PQFN - 12x12 power lead-less tray shipment (no suffix) Tray information Parameter Base Q.ty Bulk Q.ty 189 945 30/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Package and packing information Figure 37. PQFN - 12x12 power lead-less tape and reel shipment (suffix "TR") Tape dimensions Dimension A0 0.1 B0 0.1 K0 0.1 F 0.1 E 0.1 W 0.3 P2 0.1 P0 0.1 P1 0.1 T 0.05 D D1 (min) mm 12.30 12.30 2.15 11.50 1.75 24 2 4 16 0.30 1.50 1.50 Reel dimensions Dimension Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) D (min) G (+ 2 / -0) N (min) T (max) mm 1500 1500 330 1.5 13 20.2 32 100 38.4 Doc ID 15702 Rev 1 31/33 Revision history VND5004B-E, VND5004BSP30-E 6 Revision history Table 15. Date 13-May-2009 Document revision history Revision 1 Initial release. Changes 32/33 Doc ID 15702 Rev 1 VND5004B-E, VND5004BSP30-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 15702 Rev 1 33/33 |
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